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We All Provide TEG & Solutions for JISSO.

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SIPOS-TEG 製品詳細



Specification SI0631
SI0631
Wafer Size 8 inch
Wafer Thickness 725µm±25µm
Chip Size 20.0mm■
Number of Pad 36 pads
Pad Size 160µm■
Number of Chip 57chip