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KIT製品一覧表

Product	Ni/Au	Cu	Cu +OSP	E-679FG SAC	E-700G SAC	E-705G SAC	E-700G NiPdAu+ SAC	E-705G NiPdAu+ SAC	NiPdAu
CC80	－	●	●	－	－	－	－	－	－
FC150LC-1×1	－	－	－	－	－	－	－	●	－
FC120-1×1	－	●	●	－	－	●	－	－	－
FC120-2×2	－	●	●	－	－	●	－	－	－
FC150-1×1	●	●	●	●	－	－	－	－	－
FC150-2×2	－	●	●	－	●	－	－	－	－
FC200-1×1	●	●	●	●	－	－	－	－	－
FC200-2×2	●	－	－	－	●	－	－	－	－
WLP300P/400P	●	－	－	－	－	－	－	－	－

　　　　　

その他のKIT製品

• WALTS-TEG IP40-0101JY *Silicon Interposer
• WALTS-TEG IP40A-0101JY *Silicon Interposer
• WALTS-TEG IP80-0101JY *Silicon Interposer
• WALTS-KIT LCD30-0101JY
• WALTS-KIT COF30-0101JY

KIT製品詳細

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WALTS-KIT CC80(T)-0106JY【MAP】

Specification	WALTS-KIT CC80(T)-0106JY【MAP】
Structure	1-2-1 Build up Substrate
Layer Structure	Layer 1, 2 Signal Layer(Via) Layer 3, 4 Mesh
Outline	187.5mm×64.0mm×t(0.36mm)
Material	Core: HL832NSF Build Layer: GHPL-830NSF
Solder Resist Material	PSR4000 AUS-308
Lead Min L/S	32µm/48µm
Number of Lead	648
Pad Dimensions	φ0.75mm (SR opening: φ0.67mm)
Number of Measurement Pad	72 pads
Electrode	Cu + OSP

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WALTS-KIT CC80CL-0100JY【MAP】

Specification	WALTS-KIT CC80CL-0100JY【MAP】
Structure	Coreless 3L
Layer Structure	Layer 1, 2 Signal Layer(Via) Layer 3 Mesh
Outline	187.5mm×64.0mm×t(0.16mm)
Material	Build Layer: GHPL-830NSF
Solder Resist Material	PSR4000 AUS-308
Lead Min L/S	32µm/48µm
Number of Lead	648
Pad Dimensions	φ0.75mm (SR opening: φ0.67mm)
Number of Measurement Pad	72 pads
Electrode	Cu Cu + OSP

WALTS-KIT FC150LC(S)-0303JY

Specification	WALTS-KIT FC150LC(S)-0303JY
Layer Structure	2-2-2 Build up Substrate
Outline	55.0mm×55.0mm×t(0.66mm)
Material	Build Layer：ABF-GX13
Solder Resist	PSR4000 AUS-703
Land Size	φ0.13mm●
Number of Lead	25921 (161×161)
SR Opening	φ85μm●
Number of Measurement Pad	240 pads
Daisy Pattern	① Daisy Chain Pattern A: 196 Pads（14×14） ② Daisy Chain Pattern B: 72 Pads（12×6） ③ Daisy Chain Pattern C: 169 Pads（13×13） ④ Daisy Pattern D: 12 Pads（4×3）
Electrode	Electroless Plating: Ni/Pd/Au Electroless Plating: Ni/Pd/Au+SnAgCu

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WALTS-KIT 01A120P(S)-10　1×1

Specification	WALTS-01A120P(S)-10　1×1
Structure	Rigid Substrate (Both)
Outline	30.0mm×30.0mm×t(0.97mm)
Material	Core: MCL-E-705G Build Layer：ABF-GX92
Solder Resist	PSR4000 AUS-703
Land Size	φ0.095mm●
Number of Lead	5776 (76×76)
SR Opening	φ70μm●
Number of Measurement Pad	24 pads
Daisy Chain	Center Area 18×20 Matrix Corner Area 19×20 four Matrix
Electrode	Cu + OSP (option Solder Coat) *OSP: Organic Solderability Preservatives

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WALTS-KIT FC120(S)-101JY　2×2

Specification	WALTS-FC120(S)-0101JY　2×2
Structure	Rigid Substrate (Both)
Outline	35.0mm×35.0mm×t(0.97mm)
Material	Core: MCL-E-705G Build Layer：ABF-GX92
Solder Resist	PSR4000 AUS-703
Land Size	φ0.095mm●
Number of Lead	23104 (5776/chip×4)
SR Opening	φ70μm●
Number of Measurement Pad	32 pads
Daisy Chain	Center Area 38×40 Matrix Corner Area 19×20 four Matrix
Electrode	Cu + OSP (option Solder Coat) *OSP: Organic Solderability Preservatives

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WALTS-KIT 01A150P(S)-10-3　1×1

Specification	WALTS-KIT 01A150P(S)-10-3　1×1
Structure	Rigid Substrate (Both)
Outline	30.0mm×30.0mm×t(0.98mm)
Material	Build Layer：ABF-GX92
Solder Resist	PSR4000 AUS-703
Land Size	φ0.12mm●
Number of Lead	3721 (61×61)
SR Opening	φ80μm●
Number of Measurement Pad	24 pads
Daisy Chain	Center Area 16×15 Matrix Corner Area 15×15 four Matrix
Electrode	Cu + OSP (option Solder Coat) Electroless Ni/Au Plating *OSP: Organic Solderability Preservatives

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WALTS-KIT FC150(S)-0106JY　2×2（E-700G）

Specification	WALTS-KIT FC150(S)-0106JY　2×2 (E-700G)
Structure	Rigid Substrate (Both)
Outline	35.0mm×35.0mm×t(0.98mm)
Material	Build Layer：ABF-GX92
Solder Resist	PSR4000 AUS-703
Land Size	φ0.12mm●
Number of Lead	14884 (3721/chip×4)
SR Opening	φ80μm●
Number of Measurement Pad	32 pads
Daisy Chain	Center Area 30×30 Matrix Corner Area 15×15 four Matrix
Electrode	Cu + OSP (option Solder Coat) *OSP: Organic Solderability Preservatives

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WALTS-KIT 01A200P(S)-10-2 1×1

Specification	WALTS-KIT 01A200P(S)-10-2 1×1
Structure	Rigid Substrate (Both)
Outline	30.0mm×30.0mm×t(0.97mm)
Core Material	Build Layer：ABF-GX92
Solder Resist	PSR4000 AUS-703
Land Size	φ0.14mm●
Number of Lead	2116 (46×46)
Vehicle	10mm×10mm 200μm pitch area
SR Opening	φ95μm●
Number of Measurement Pad	24 pads
Daisy Chain	Center Area 12×12 Matrix Corner Area 12×11 four Matrix
Electrode	Cu + OSP (option Solder Coat) *OSP: Organic Solderability Preservatives

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WALTS-KIT FC200-0102JY 2×2

Specification	WALTS-KIT FC200-0102JY　2×2
Structure	Rigid Substrate (Both)
Outline	35.0mm×35.0mm×t(0.87mm)
Material	core: E-700GR
Solder Resist	PSR4000 AUS-703
Land Size	φ0.14mm●
Number of Lead	8464 (2116/chip×4)
Vehicle	20mm×20mm 200μm pitch area
SR Opening	φ95μm●
Number of Measurement Pad	32 pads
Daisy Chain	Center Area 20×18 Matrix Corner Area 12×11 four Matrix
Electrode	Cu + OSP (option Solder Coat) *OSP: Organic Solderability Preservatives

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WALTS-KIT WLP(S)300P/400P-2

Specification	WALTS-KIT WLP(S)300P/400P-2 * for WLP TEG (0.4mm pitch & 0.3mm pitch)
Structure	1-2-1 Build up Substrate
Layer Structure	Layer1:WLP300P Layer4:WLP400P
Outline	30.0mm×30.0mm×t(0.98mm)
Core Material	Core: E-679FGR Build Layer: ABF-GX13
Solder Resist Material	PSR4000 AUS-703
Number of Lead	WLP300P: 264 WLP400P: 144
Pad Dimensions	2.4mm×4.0mm (SR opening: 2.2mm×3.8mm)
Number of Measurement Pad	15 pads
Electrode	Electroless Ni/Au plating

WALTS-KIT LCD30A-0101JY

Specification	WALTS-KIT LCD30A-0101JY
Material	Non Alkali Glass
Outline	52.55mm×24.00mm×t(0.70mm)
Wire Material	ITO 1,500Å (option IZO)
Function	‐‐Daisy Chain ‐‐Breakdown Voltage Check between the Bumps
Conformed Chip	WALTS-TEG LCD30A-0101JY

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WALTS-KIT COF30-0101JY

Specification	WALTS-KIT COF30-0101JY
State	Reel
Product Name	S'PERFLEX
Plating Material	Sn
Conformed Chip	WALTS-TEG LCD30A-0101JY

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