SIPOS-TEGPRODUCTS
SIPOS-TEG 製品詳細
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Wafer Shot Map |
| Specification | SB0401 |
SB0402 |
SB0403 |
SB0404 |
|---|---|---|---|---|
| Wafer Size | φ 8 inch | |||
| Wafer Thickness | 725µm±25µm | |||
| Chip Size | 3.0mm■ | 3.0mm■ | 3.0mm■ | 3.0mm■ |
| Pad Pitch | 60μm Periphral | 80μm Periphral | 100μm Periphral | 300μm Staggered |
| Number of Pad | 168pad | 120pad | 96pad | 256pad |
| Pad Size | 46μm■ | 60μm■ | 80μm■ | 32μm■ |
| Pad Opening Size | 40μm■ | 50μm■ | 70μm■ | 26μm■ |
| Scribe Width | 100μm | 100μm | 100μm | 100μm |
| Comb Dimension | L/S = 7μm/7μm | L/S = 10μm/10μm | L/S = 12μm/12μm | L/S = 5μm/5μm |
| Number of Comb | 70 (35×2) | 50 (25×2) | 40 (20×2) | 100 (50×2) |
| Interlayer Dielectric Patter |
φ1.0mm (Octagon) | φ1.0mm (Octagon) | φ1.0mm (Octagon) | φ1.0mm (Octagon) |
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Wafer Shot Map |
| Specification | SB0501 |
SB0502 |
SB0601 |
SB0602 |
|---|---|---|---|---|
| Wafer Size | φ 8 inch | |||
| Wafer Thickness | 725µm±25µm | |||
| Chip Size | 3.0mm■ | 3.0mm■ | 3.0mm■ | 3.0mm■ |
| Pad Pitch | 150μm | 300μm | 150μm | 300μm |
| Number of Pad | 324pad | 64pad | 68pad | 32pad |
| Daisy Chain Pad | 180pad | 32pad | － | － |
| Pad Size | 100μm■ | 190μm■ | 100μm■ | 190μm■ |
| Pad Opening | φ90μm | φ180μm | φ100μm | φ180μm |
| Scribe Width | 100μm | 100μm | 100μm | 100μm |
| Comb Dimension | － | － | L/S = 18μm/18μm | L/S = 36μm/36μm |
| Number of Comb | － | － | 28 (14×2) | 14 (7×2) |
| Interlayer Dielectric Patter |
－ | － | φ1.0mm (Octagon) | φ1.0mm (Octagon) |
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Wafer Shot Map |
| Specification | A |
B |
C |
D |
|---|---|---|---|---|
| Wafer Size | φ 8 inch | |||
| Wafer Thickness | 725µm±25µm | |||
| Chip Size | 20.0mm■ | 20.0mm■ | 20.0mm■ | 20.0mm■ |
| TSV Hole Diameter | ●20μm ■20μm | ●30μm ■30μm | ●50μm ■50μm | ●80μm ■80μm |
| TSV Pitch (X) | 80μm | 120μm | 150μm | 200μm |
| TSV Pitch (Y) | 40μm, 50μm, 60μm | 60μm, 80μm, 100μm | 80μm, 100μm, 120μm | 120μm, 150μm, 220μm |