【Head Office】
Fukuoka Solution Center for Advanced Semiconductor Packaging #303,
1963-4 Higashi, Itoshima-shi, Fukuoka 819-1122, JAPAN
→MAP TEL. +81-92-332-1271
FAX. +81-92-332-1281
【Tokyo Office】
Wind Kitashinjuku Bldg.7F 1-1-17 Kita Shinjuku,
Shinjuku-Ku, Tokyo 169-0074 JAPAN
TEL. +81-3-3361-2652
FAX. +81-3-3361-2672
Capital
10,000,000 Yen
Establish
Apr.02.2007
Main Business
Develop and provide the advanced test element group wafer (die)/test kit.
Collaboratibe research with an academic institute on advanced assembly
technologies. Film sputtering and deposition, backgrinding, dicing service
on test wafer/glass.