SIPOS-TEGPRODUCTS
SIPOS-TEG Product Details
| Specification | SI0631 |
|
|---|---|---|
| Wafer Size | 8 inch | |
| Wafer Thickness | 725µm±25µm | |
| Chip Size | 20.0mm■ | |
| Number of Pad | 36 pads | |
| Pad Size | 160µm■ | |
| Number of Chip | 57chip | |
| Specification | SI0631 |
|
|---|---|---|
| Wafer Size | 8 inch | |
| Wafer Thickness | 725µm±25µm | |
| Chip Size | 20.0mm■ | |
| Number of Pad | 36 pads | |
| Pad Size | 160µm■ | |
| Number of Chip | 57chip | |