Custom-make test production of TEG wafer/glass
Patterned wafer/glass for TEG
| Base |
Φ6～Φ12inch
Silicon wafer, Glass wafer |
| Process |
Oxidizing, Sputtering, Photolithography, Etching, CVD, PVD, Plating, Ball
mounting, Printing |
| Qty. |
a small quantity～ |
| Remarks |
Patterning, plating and ball mounting on glass wafer are also possible. |
Design and provide custom-make test kit
Patterned test kit for TEG
| Base |
Rigid test kit for TEG, Strip test kit, Flexible printed circuits, other |
| Process |
Multilayer test kit, buildup test kit, etc. |
| Qty. |
a small quantity～ |
| Remarks |
- |
Au stud bump
| Base |
WALTS TEG chip, customer's product, chip with Al film, etc. |
| Experience |
WALTS TEG with 50um pitch, pad opening 40um |
| Qty. |
a small quantity～ |
| Remarks |
- |
Backgrinding
| Base |
Φ6～Φ12inch, WALTS TEG , Mirror wafers, |
| Backgrinding |
Stress relief after backgrinding |
| Experience |
Φ8inch mirror wafer: t=25um
Φ8inch TEG with ball mounted : t=50um |
| Remarks |
Handling with wafer ring and protoss carrier for ultra thin backgrinding
wafer. |
Dicing and tray packing
| Base |
Φ6～Φ12inch, WALTS TEG, Mirror wafers, Glass |
| Qty. |
a small quantity～ |
| Experience |
Φ8inch mirror wafer: □0.25mm |
| Remarks |
- |
Silicon wafer
| Size |
Φ4~Φ12 |
| Type |
Prime wafers, Monitor wafers, etc. |
| Qty. |
a small quantity～ |
| Remarks |
Asslice wafers are also available |
Glass wafers
| Size |
Φ6、Φ8 |
| Type |
Tempax, etc. |
| Qty. |
a small quantity～ |
| Remarks |
Multi layer is also possible (ex. : Si/SiO2(3000)/Ta(3000Å) |
Silicon wafer with metal film
| Size |
Φ8 |
| Type |
Al, AlCu, Ta, Ti, Au, Pt, Au, Cu, etc. |
| Qty. |
a small quantity～ |
| Remarks |
Multi layer is also possible (ex. : Si/SiO2(3000)/Ta(3000Å) |
Silicon wafer with other films
| Size |
Φ8 |
| Type |
Polyimide, Low-K, PBO, BCB, ITO, etc. |
| Qty. |
a small quantity～ |
| Remarks |
Laminate is also possible (ex. :Si/TEOS (3000Å) PI(4um)) |
