



We open up next-generation assembly technology for semiconductor with leading-edge
          technologies and information that we have developed over many years.As
          the de facto standard, our products are used in the research and development
          site world wide.Our well experienced architects can also custom-make TEG
          to better suit your needs.A wide variety of film sputtering and deposition,
          back grinding, dicing, bump forming, assembing and analysis are available.Our
          high-quality service are all Made in Japan!
          
* TEG = Test Element Group * KIT = Test Kit
          
Fukuoka Solution Center for Advanced Semiconductor Packaging #303, 1963-4 Higashi, Itoshima-shi, Fukuoka 819-1122, JAPAN
TEL +81-92-332-1271