



We open up next-generation assembly technology for semiconductor with leading-edge
technologies and information that we have developed over many years.As
the de facto standard, our products are used in the research and development
site world wide.Our well experienced architects can also custom-make TEG
to better suit your needs.A wide variety of film sputtering and deposition,
back grinding, dicing, bump forming, assembing and analysis are available.Our
high-quality service are all Made in Japan!
* TEG = Test Element Group * KIT = Test Kit
Fukuoka Solution Center for Advanced Semiconductor Packaging #303, 1963-4 Higashi, Itoshima-shi, Fukuoka 819-1122, JAPAN
TEL +81-92-332-1271